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| DIM200PLM33-F000 . IGBT Chopper Module DS5863- 1.0 September 2005 (LN24182) FEATURES * * * 10s Short Circuit Withstand Soft Punch Through Silicon Isolated AlSiC Base with AlN substrates High thermal cycling capability KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK) (max) * 3300V 2.8V 200A 400A * (measured at the power busbars and not the auxiliary terminals) APPLICATIONS * * * * Choppers Motor Controllers Power Supplies Traction Auxiliaries The Powerline range of high power modules includes half bridge, chopper, dual, single and bidirectional switch configurations covering voltages from 600V to 3300V and currents up to 2400A. The DIM200PLM33-F000 is a 3300V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) chopper module configured with the lower arm of the bridge controlled. The IGBT has a wide reverse bias safe operating area (RBSOA) plus full 10s short circuit withstand. This device is optimised for traction drives and other applications requiring high thermal cycling capability. The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. Fig. 1 Chopper circuit diagram ORDERING INFORMATION Order As: DIM200PLM33-F000 Note: When ordering, please use the whole part number. Outline type code: P (See package details for further information) Fig. 2 Electrical connections (not to scale) Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/9 www.dynexsemi.com DIM200PLM33-F000 SEMICONDUCTOR ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under `Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25 C unless stated otherwise Symbol VCES VGES IC IC(PK) Pmax It Visol QPD 2 Parameter Collector-emitter voltage Gate-emitter voltage Continuous collector current Peak collector current Max. transistor power dissipation Diode I t value (IGBT arm) 2 Diode I t value (Diode arm) Isolation voltage - per module Partial discharge - per module 2 Test Conditions VGE = 0V Max. 3300 20 Units V V A A W kA S V pC 2 Tcase = 90 C 1ms, Tcase =115 C Tcase = 25 C, T j = 150 C VR = 0, tP = 10ms, Tvj = 125 C Commoned terminals to base plate. AC RMS, 1 min, 50Hz IEC1287. V1 = 3500V, V2 = 2600V, 50Hz RMS 200 400 2.6 20 20 6000 10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 2/9 www.dynexsemi.com DIM200PLM33-F000 SEMICONDUCTOR THERMAL AND MECHANICAL RATINGS Internal insulation material: Baseplate material: Creepage distance: Clearance: CTI (Critical Tracking Index): AIN AlSiC 33mm 20mm 175 Symbol Parameter Test Conditions Min. Typ. Max. Units Rth(j-c) Thermal resistance - transistor Continuous dissipation - junction to case - - 48 C/kW Thermal resistance - diode (IGBT Rth(j-c) arm) Thermal resistance- diode ( Diode arm) Thermal resistance - case to heatsink (per module) Tj Junction temperature Continuous dissipation - junction to case 96 C/kW 96 C/kW Rth(c-h) Mounting torque 5Nm (with mounting grease) Transistor Diode - - 16 C/kW -40 - - 150 125 125 5 4 C C C Nm Nm Tstg - Storage temperature range Screw torque Mounting - M6 Electrical connections - M5 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 3/9 www.dynexsemi.com DIM200PLM33-F000 SEMICONDUCTOR ELECTRICAL CHARACTERISTICS Tcase = 25 C unless stated otherwise. Symbol Ices Parameter Collector cut-off current Test Conditions VGE = 0V, VCE = VCES VGE = 0V, VCE = VCES, Tcase = 125 C Min. 5.5 I1 I2 - Typ. 6.5 2.8 3.6 2.9 2.9 3.0 3.0 36 40 0.5 1000 930 Max. 1 15 1 7.0 200 400 - Units mA mA A V V V A A V V nF nH m A A Ices VGE(TH) VCE(sat) Gate leakage current Gate threshold voltage Collector-emitter saturation voltage VGE = 20V, VCE = 0V IC = 40mA, VGE = VCE VGE = 15V, IC = 200A VGE = 15V, IC = 200A, Tcase = 125 C IF IFM VF Diode forward current Diode maximum forward current Diode forward voltage (IGBT arm) Diode forward voltage (Diode arm) Diode forward voltage (IGBT arm) Diode forward voltage (Diode arm) Input capacitance Module inductance - per arm Internal resistance - per arm Short circuit. Isc DC tp = 1ms IF = 200A IF = 200A, Tcase = 125 C VCE = 25V, VGE = 0V, f = 1MHz Tj = 125 C, V cc = 2500V, tp 10s, VCE(max) = VCES - L*xdi/dt IEC 60747-9 Cies LM RINT SCData Note: Measured at the power busbars and not the auxiliary terminals * L is the circuit inductance + LM Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 4/9 www.dynexsemi.com DIM200PLM33-F000 SEMICONDUCTOR ELECTRICAL CHARACTERISTICS Tcase = 25 C unless stated otherwise. Symbol td(off) tf EOFF td(on) tr Qg EON Qrr Irr EREC Parameter Turn-off delay time Fall time Turn-off energy loss Turn-on delay time Rise time Gate charge Turn-on energy loss Diode reverse recovery charge Diode reverse current Diode reverse recovery energy Test Conditions IC = 200A VGE = 15V VCE = 1800V RG(ON) = RG(OFF) = 16.5 L 100nH Cge = 56nF RG(ON) = 7.5 IF = 200A, VR = 1800V, dlF/dt = 1600A/s Diode arm Min. Typ. 1950 170 220 1180 225 5 290 80 144 75 Max. Units ns ns mJ ns ns C mJ C A mJ Tcase = 125 C unless stated otherwise. Symbol td(off) tf EOFF td(on) tr EON Qrr Irr EREC Parameter Turn-off delay time Fall time Turn-off energy loss Turn-on delay time Rise time Turn-on energy loss Diode reverse recovery charge Diode reverse current Diode reverse recovery energy Test Conditions IC = 200A VGE = 15V VCE = 1800V RG(ON) = RG(OFF) = 16.5 L 100nH, Cge = 56nF RG(ON) = 7.5 IF = 200A, VR = 1800V, dlF/dt = 1600A/s Diode arm Min. Typ. 2200 190 265 1150 280 390 125 155 130 Max. Units ns ns mJ ns ns mJ C A mJ Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 5/9 www.dynexsemi.com DIM200PLM33-F000 SEMICONDUCTOR Fig.3 Typical output characteristics Fig.4 Typical output characteristics Fig.5 Typical switching energy vs collector current Fig.6 Typical switching energy vs gate resistance Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 6/9 www.dynexsemi.com DIM200PLM33-F000 SEMICONDUCTOR Fig.7 Diode typical forward characteristics Fig.8 Reverse bias safe operating area Fig.9 Diode reverse bias safe operating area Fig.10 Transient thermal impedance Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 7/9 www.dynexsemi.com DIM200PLM33-F000 SEMICONDUCTOR PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Nominal weight: 750 g Module outline type code: P Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 8/9 www.dynexsemi.com DIM200PLM33-F000 SEMICONDUCTOR POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln Lincolnshire, LN6 3LF. United Kingdom. Tel: +44(0)1522 500500 Fax: +44(0)1522 500550 CUSTOMER SERVICE Tel: +44(0)1522 502753 / 502901. Fax: +44(0)1522 500020 Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRODUCED IN UNITED KINGDOM. Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hand corner of the front page, to indicate product status. The annotations are as follows:- Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 9/9 www.dynexsemi.com |
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